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Overview

Range/Series Overview


IMPORTANT: This Range/Series overview section describes the range of which this product belongs. Features of different versions might be mentioned and may not apply to the specific product on this page. Please view Specs for specification of product.

Improve the Heat Transfer between a CPU and Heatsink through a Ceramic/Silicone Compound. The HEATGREASE20 CPU Thermal Paste Compound can be used to improve the effectiveness of a CPU cooler, by thermally bonding the surface of the CPU to the heatsink, which enables the heatsink and fan to work more efficiently to remove harmful heat from the CPU.

This 20g tube of ceramic-based thermal grease is enough for a large number of CPU installations for most home or business computers or any other light application where good thermal bonding between two surfaces is required.


Features Summary

  • Effective thermal conductivity
    With a thermal conductivity of 1.066 W/mK, this thermal paste enhances heat dissipation, helping to maintain optimal processor temperatures.
  • Wide temperature range
    This thermal compound operates effectively in a temperature range from -20°C to 100°C, ensuring reliability in various conditions.

Specification Summary

Product Description
Startech 20g Tube CPU Thermal Paste Grease Compound for Heatsinks - heat grease - cpu paste - thermal compound (HEATGREASE20) - processor heatsink paste
Product Type
Processor heatsink paste
Dimensions (WxDxH)
7.2 cm x 3 cm x 1.8 cm
Weight
24 g
Manufacturer Warranty
2-year warranty
Designed For
P/N: FAN1156PWM

Specifications

EAN / GTIN:
0065030844826
General
Product Type
Processor heatsink paste
Width
7.2 cm
Depth
3 cm
Height
1.8 cm
Weight
24 g
Miscellaneous
Thermal Conductivity
1.066 W/mK
Manufacturer Warranty
Service & Support
Limited warranty: - 2 years
Environmental Parameters
Min Operating Temperature
-20 °C
Max Operating Temperature
100 °C
Compatibility Information
Designed For
P/N: FAN1156PWM

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